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Inventor

Minami Nagaoka

Inventor
Okayama, JP

Overview

2→
Patents
2017–2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder40%
B23KSoldering or unsoldering40%
H05KPrinted circuits20%
PatentTitleYear
10,328,534Bonding material and bonding method using same20199,533,380'Bonding material and bonding method in which said bonding material is used'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2019Patents assigned to DOWA ELECTRONICS MATERIALS CO LTD (2)· patent assignee history
2017Patents assigned to ENDOH KEIICHI (1)· patent assignee history
2017Patents assigned to KURITA SATORU (1)· patent assignee history
2017Patents assigned to NAGAOKA MINAMI (1)· patent assignee history
2017–2019Based in Okayama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DOWA ELECTRONICS MATERIALS CO LTD22017–2019
ENDOH KEIICHI12017
KURITA SATORU12017
NAGAOKA MINAMIself12017
Locations
LocationPatentsSpan
Okayama, JP22017–2019