Inventor
Yasuyuki Sanda
Inventor
JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H05KPrinted circuits14%
PatentTitleYear
12,477,704Power semiconductor device and method of manufacturing the same, and power conversion device202511,322,430Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resin202211,152,280Semiconductor device and method for manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to MITSUBISHI ELECTRIC CORP (3)· patent assignee history
2021–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 3 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 3 | 2021–2025 |