Inventor

JULIUS KOSKELA

Inventor
FI

Overview

37→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 37 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H03Hprimary
H03HImpedance networks, e.g. resonant circuits75%
G06FElectric digital data processing8%
H10NElectric solid-state devices not otherwise provided for8%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure4%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers4%
PatentTitleYear
12,525,952Transversely-excited film bulk acoustic resonator with optimized piezoelectric plate thickness and electrode mark and pitch202612,489,421Transversely-excited film bulk acoustic resonator with multi-mark, multi-pitch interdigital transducer202512,431,855Acoustic resonators with high acoustic velocity layers202512,375,056Transversely-excited film bulk acoustic resonators202512,301,212XBAR resonators with non-rectangular diaphragms202512,267,062Transversely-excited film bulk acoustic resonators with three-layer electrodes202512,255,605Transversely-excited film bulk acoustic resonators with electrodes having a second layer of variable width202512,244,295Transversely-excited film bulk acoustic resonators with two-layer electrodes having a narrower top layer202512,237,826Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch202512,160,220Transversely-excited film bulk acoustic resonator with oxide strip acoustic confinement structures202412,088,281Transversely-excited film bulk acoustic resonator with multi-mark interdigital transducer202412,074,584Transversely-excited film bulk acoustic resonators with two-layer electrodes202412,021,504Transversely-excited film bulk acoustic resonator with a front-side dielectric layer and optimized pitch and mark202412,021,502Transversely-excited film bulk acoustic resonator with multi-mark electrodes and optimized electrode thickness202412,009,798Transversely-excited film bulk acoustic resonators with electrodes having irregular hexagon cross-sectional shapes202411,996,827Transversely-excited film bulk acoustic resonator with periodic etched holes202411,942,922Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch202411,936,361Transversely-excited film bulk acoustic resonators202411,929,727Transversely-excited film bulk acoustic resonator with reduced spurious modes202411,929,735XBAR resonators with non-rectangular diaphragms202411,929,731Transversely-excited film bulk acoustic resonator with optimized electrode mark, and pitch202411,923,821Transversely-excited film bulk acoustic resonator with reduced spurious modes202411,909,381Transversely-excited film bulk acoustic resonators with two-layer electrodes having a narrower top layer202411,901,878Transversely-excited film bulk acoustic resonators with two-layer electrodes with a wider top layer202411,881,834Transversely-excited film bulk acoustic resonator with reduced spurious modes202411,855,602Transversely-excited film bulk acoustic resonators with electrodes having a second layer of variable width202311,835,414Passive pressure sensor with a piezoelectric diaphragm and a non-piezoelectric substrate202311,831,289Transversely-excited film bulk acoustic resonator with reduced spurious modes202311,817,840XBAR resonators with non-rectangular diaphragms202311,736,090Film bulk acoustic resonators in thin LN-LT layers202311,728,786Fast, highly accurate, full-FEM surface acoustic wave simulation202311,626,852Hierarchical cascading in two-dimensional finite element method simulation of acoustic wave filter devices202311,296,677Fast, highly accurate, full-FEM surface acoustic wave simulation202211,251,775Film bulk acoustic resonators in thin LN-LT layers202211,182,522Hierarchical cascading in FEM simulations of SAW devices202111,146,232Transversely-excited film bulk acoustic resonator with reduced spurious modes202111,143,561Passive microphone/pressure sensor using a piezoelectric diaphragm2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to RESONANT INC (5)· patent assignee history
2021–2026Based in FI· patent location history
2023–2026Patents assigned to MURATA MANUFACTURING CO (32)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MURATA MANUFACTURING CO322023–2026
RESONANT INC52021–2022
Locations
LocationPatentsSpan
FI372021–2026