Inventor
I-Nan Chen
Inventor
Taipei, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10DInorganic electric semiconductor devices17%
G11CStatic stores8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%
PatentTitleYear
10,727,205Hybrid bonding technology for stacking integrated circuits202010,658,409Semiconductor structure and method of manufacturing the same202010,541,297Semiconductor structure having integrated inductor therein202010,164,001Semiconductor structure having integrated inductor therein20187,525,848'Method for erasing and changing data of floating gate flash memory'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009Patents assigned to AMIC TECHNOLOGY CORP (1)· patent assignee history
2009Based in Taichung, TW· patent location history
2018–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2018–2020Based in Taipei, TW· patent location history
2020Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD U (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2018–2020 |
| AMIC TECHNOLOGY CORP | 1 | 2009 |
| TAIWAN SEMICONDUCTOR MFG COMPANY LTD U | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 4 | 2018–2020 |
| Taichung, TW | 1 | 2009 |