Inventor
Chun Hong Wo
Inventor
Singapore, SG
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H05KPrinted circuits7%
PatentTitleYear
10,403,592Semiconductor packages and methods of packaging semiconductor devices20199,960,130Reliable interconnect20189,786,625'Semiconductor packages and methods of packaging semiconductor devices'20179,165,878'Semiconductor packages and methods of packaging semiconductor devices'20159,087,777'Semiconductor packages and methods of packaging semiconductor devices'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to UNITED TEST & ASSEMBLY CT LT (2)· patent assignee history
2015–2019Based in Singapore, SG· patent location history
2017–2019Patents assigned to UNITED TEST AND ASSEMBLY CENTER LTD (3)· patent assignee history
2017–2019Patents assigned to UTAC HEADQUARTERS PTE LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED TEST AND ASSEMBLY CENTER LTD | 3 | 2017–2019 |
| UTAC HEADQUARTERS PTE LTD | 3 | 2017–2019 |
| UNITED TEST & ASSEMBLY CT LT | 2 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 5 | 2015–2019 |