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Inventor

Ying-Nan Wen

Inventor
Hsinchu, TW

Overview

33→
Patents
2001–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
H10DInorganic electric semiconductor devices4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
G06FElectric digital data processing2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
G06KGraphical data reading1%
PatentTitleYear
10,157,875Chip package and method for forming the same201810,140,498Wafer-level packaging sensing device and method for forming the same201810,056,419Chip package having chip connected to sensing device with redistribution layer in insulator layer20189,966,358Chip package20189,935,148Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer20189,831,185Chip package and fabrication method thereof20179,812,413'Chip module and method for forming the same'20179,780,050'Method of fabricating chip package with laser'20179,768,067'Chip package and manufacturing method thereof'20179,721,911'Chip package and manufacturing method thereof'20179,640,405'Chip package having a laser stop structure'20179,543,233'Chip package having a dual through hole redistribution layer structure'20179,406,578'Chip package having extended depression for electrical connection and method of manufacturing the same'20169,379,072'Chip package and method for forming the same'20169,281,243'Chip scale package structure and manufacturing method thereof'20169,236,320'Chip package'20169,177,919'Chip package and method for forming the same'20159,153,707'Chip package and method for forming the same'20159,093,450'Chip package and manufacturing method thereof'20158,981,497'Chip package structure and method for forming the same'20158,823,179'Electronic device package and method for fabricating the same'20148,791,768'Capacitive coupler packaging structure'20148,778,798'Electronic device package and fabrication method thereof'20148,766,431'Power MOSFET package'20148,710,680'Electronic device package and fabrication method thereof'20148,692,284'Interposer and manufacturing method thereof'20148,643,070'Chip package and method for forming the same'20148,614,488'Chip package and method for forming the same'20138,610,271'Chip package and manufacturing method thereof'20138,564,133'Chip package and method for forming the same'20138,410,599'Power MOSFET package'20136,365,498'Integrated process for I/O redistribution and passive components fabrication and devices formed'20026,268,114'Method for forming fine-pitched solder bumps'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2018Based in Hsinchu, TW· patent location history
2013–2015Patents assigned to WEN YING-NAN (10)· patent assignee history
2013–2015Patents assigned to LIU CHIEN-HUNG (7)· patent assignee history
2013–2014Patents assigned to CHANG SHU-MING (6)· patent assignee history
2013–2015Patents assigned to YIU HO-YIN (4)· patent assignee history
2014–2018Patents assigned to XINTEC INC (22)· patent assignee history
2014Based in Taoyuan, TW· patent location history
2015Based in Jhubei City, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
XINTEC INC222014–2018
WEN YING-NANself102013–2015
LIU CHIEN-HUNG72013–2015
CHANG SHU-MING62013–2014
YIU HO-YIN42013–2015
Locations
LocationPatentsSpan
Hsinchu, TW312001–2018
Jhubei City, TW12015
Taoyuan, TW12014