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Inventor

Seppo J. Lehtonen

Inventor
Columbia, MD, US

Overview

4→
Patents
2004–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits25%
C23CCoating metallic material13%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light13%
G01RMeasuring electric variables13%
H03CModulation13%
H03HImpedance networks, e.g. resonant circuits13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
11,067,449Multispectral imager20219,844,169'Ka band multi-chip modulator'20176,881,593'Semiconductor die adapter and method of using'20056,733,823'Method for electroless gold plating of conductive traces on printed circuit boards'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2021Patents assigned to UNIV JOHNS HOPKINS (4)· patent assignee history
2004–2021Based in Columbia, MD, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNIV JOHNS HOPKINS42004–2021
Locations
LocationPatentsSpan
Columbia, Maryland, US42004–2021