Inventor
Masao Sekibata
Inventor
Kunitachi, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H05KPrinted circuits19%
B23KSoldering or unsoldering6%
C23CCoating metallic material6%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
H01RElectrically-conductive connections6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
Y02PClimate change mitigation technologies in the production or processing of goods6%
Y10TTechnical subjects covered by former us classification6%
PatentTitleYear
4,910,094'Multilayer plating method and multilayer plated film'19904,765,528'Plating process for an electronic part'19884,739,125'Electric component part having lead terminals'19884,630,095'Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering'19864,580,713'Method for bonding an aluminum wire'19864,541,003'Semiconductor device including an alpha-particle shield'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–1990Patents assigned to HITACHI LTD (5)· patent assignee history
1985–1990Based in Kunitachi, JP· patent location history
1986Patents assigned to VLSI TECHNOLOGY RES ASS (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 5 | 1985–1990 |
| VLSI TECHNOLOGY RES ASS | 1 | 1986 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kunitachi, JP | 6 | 1985–1990 |