Inventor
Kenta Ogawa
Inventor
Kanagawa, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H05KPrinted circuits14%
Y10TTechnical subjects covered by former us classification9%
H01LSemiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
A63FCard, board, or roulette games3%
G06FElectric digital data processing3%
G11CStatic stores3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
10,857,461Game control device, game system, and information storage medium202010,773,154Game control device, game system, and information storage medium20209,666,659'External storage device and method of manufacturing external storage device'20179,362,263'Semiconductor device'2016RE045987'Electronic component and method of manufacturing the same'20169,165,879'Semiconductor device'20158,810,021'Semiconductor device including a recess formed above a semiconductor chip'20148,772,914'Semiconductor device'20148,753,922'Method of manufacturing a semiconductor device'20148,705,238'External storage device and method of manufacturing external storage device'20148,389,414'Method of manufacturing a wiring board'20138,378,470'Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof'20138,357,935'Electronic component having an authentication pattern'20138,283,770'Semiconductor device and communication method'20127,982,303'Semiconductor device and communication method'20117,911,038'Wiring board, semiconductor device using wiring board and their manufacturing methods'20117,838,779'Wiring board, method for manufacturing same, and semiconductor package'20107,745,736'Interconnecting substrate and semiconductor device'20107,701,726'Method of manufacturing a wiring substrate and semiconductor device'20107,674,989'Wiring board and method for manufacturing the same'20107,649,749'Wiring substrate, semiconductor device, and method of manufacturing the same'20107,235,309'Electronic device having external terminals with lead-free metal thin film formed on the surface thereof'20076,884,523'Electronic component and method of manufacturing the same'20056,391,179'Plating apparatus and method of preventing substitute deposition'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2013Patents assigned to NEC CORP (7)· patent assignee history
2002–2020Based in Tokyo, JP· patent location history
2005–2010Patents assigned to NEC ELECTRONICS CORP (7)· patent assignee history
2005–2016Based in Kanagawa, JP· patent location history
2010–2017Based in Kawasaki, JP· patent location history
2011–2017Patents assigned to RENESAS ELECTRONICS CORP (14)· patent assignee history
2012–2014Patents assigned to OGAWA KENTA (6)· patent assignee history
2012–2014Patents assigned to NAKASHIBA YASUTAKA (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 14 | 2011–2017 |
| NEC CORP | 7 | 2002–2013 |
| NEC ELECTRONICS CORP | 7 | 2005–2010 |
| OGAWA KENTAself | 6 | 2012–2014 |
| NAKASHIBA YASUTAKA | 4 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 18 | 2005–2016 |
| Tokyo, JP | 3 | 2002–2020 |
| Kawasaki, JP | 3 | 2010–2017 |