Inventor
EVERETT A. MCTEER
Inventor
US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices32%
H01LSemiconductor devices26%
H10DInorganic electric semiconductor devices15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
G11CStatic stores5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
H10NElectric solid-state devices not otherwise provided for2%
PatentTitleYear
12,471,281Methods used in forming memory arrays having strings of memory cells202512,432,984Microelectronic devices including stack structures having doped interfacial regions, and related systems and methods202512,408,414Transistor and memory circuitry comprising strings of memory cells202512,381,153Microelectronic devices, memory devices, and electronic systems202512,368,101Apparatuses including interconnect structures including dielectric material surrounded by conductive material, and related memory devices202512,322,443Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells202512,170,250Microelectronic devices and memory devices including conductive levels having varying compositions202412,114,492Memories having vertically stacked conductive filled structures202412,034,057Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material202412,002,759Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material202411,990,528Assemblies having conductive structures with three or more different materials202411,894,305Microelectronic devices including staircase structures, and related memory devices and electronic systems202411,742,282Conductive interconnects202311,705,500Assemblies having conductive structures with three or more different materials202311,672,191Semiconductor devices comprising threshold switching materials202311,594,495Microelectronic devices including conductive levels having varying compositions, and related memory devices, electronic systems, and methods202311,527,548Semiconductor devices and electronic systems including an etch stop material, and related methods202211,393,756Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems202211,342,265Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems202211,315,877Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems202211,158,718Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to MICRON TECHNOLOGY INC (18)· patent assignee history
2021–2025Based in US· patent location history
2024–2025Patents assigned to LODESTAR LICENSING GROUP LLC (3)· patent assignee history
2025Patents assigned to BATTELLE ENERGY ALLIANCE LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 18 | 2021–2025 |
| LODESTAR LICENSING GROUP LLC | 3 | 2024–2025 |
| BATTELLE ENERGY ALLIANCE LLC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 21 | 2021–2025 |