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Inventor

ALFRED GRILL

Inventor
US

Overview

3→
Patents
2021–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material29%
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
12,183,702Electronic package with varying interconnects202411,186,911Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same202111,177,167Ultrathin multilayer metal alloy liner for nano Cu interconnects2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2024Patents assigned to IBM (3)· patent assignee history
2021–2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM32021–2024
Locations
LocationPatentsSpan
US32021–2024