Inventor
Brenda L. Peterson
Inventor
Wappingers Falls, NY, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
Y10TTechnical subjects covered by former us classification16%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
B41MPrinting, duplicating, marking, or copying processes4%
G02BOptical elements, systems or apparatus4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
B23KSoldering or unsoldering2%
B41PIndexing scheme relating to printing, lining machines, typewriters, and to stamps2%
G06FElectric digital data processing2%
PatentTitleYear
10,922,339Portable globe creation for a geographical information system20218,089,133'Optical assemblies for transmitting and manipulating optical beams'20127,278,207'Method of making an electronic package'20076,961,995'Method of making an electronic package'20056,836,015'Optical assemblies for transmitting and manipulating optical beams'20046,740,959'EMI shielding for semiconductor chip carriers'20046,595,136'Method for displacing an article during screening'20036,543,347'Apparatus for displacing an article during screening'20036,486,415'Compliant layer for encapsulated columns'20026,475,555'Process for screening features on an electronic substrate with a low viscosity paste'20026,458,623'Conductive adhesive interconnection with insulating polymer carrier'20026,429,388'High density column grid array connections and method thereof'20026,402,866'Powdered metallic sheet method for deposition of substrate conductors'20026,341,417'Pre-patterned substrate layers for being personalized as needed'20026,017,025'Component retainer'20005,996,985'Component retainer'19995,927,193'Process for via fill'19995,846,361'Lamination process for producing non-planar substrates'19985,808,268'Method for marking substrates'19985,787,578'Method of selectively depositing a metallic layer on a ceramic substrate'19985,645,673'Lamination process for producing non-planar substrates'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2012Patents assigned to IBM (20)· patent assignee history
1997–2012Based in Wappingers Falls, NY, US· patent location history
2012Patents assigned to GUPTA DINESH (1)· patent assignee history
2012Patents assigned to PETERSON BRENDA L (1)· patent assignee history
2012Patents assigned to PIERSON MARK V (1)· patent assignee history
2021Patents assigned to GOOGLE LLC (1)· patent assignee history
2021Based in Lafayette, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 20 | 1997–2012 |
| GOOGLE LLC | 1 | 2021 |
| GUPTA DINESH | 1 | 2012 |
| PETERSON BRENDA Lself | 1 | 2012 |
| PIERSON MARK V | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 20 | 1997–2012 |
| Lafayette, California, US | 1 | 2021 |