Inventor
CHUNG-SUNG CHIANG
Inventor
TW
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,243,839Bonded semiconductor structure utilizing concave/convex profile design for bonding pads202511,935,854Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads202411,640,949Bonded semiconductor structure utilizing concave/convex profile design for bonding pads2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to UNITED MICROELECTRONICS CORP (3)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 3 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 3 | 2023–2025 |