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Inventor

Wang Lai Lee

Inventor
Singapore, SG

Overview

6→
Patents
2009–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1056%
H01LSemiconductor devices22%
G02BOptical elements, systems or apparatus11%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light11%
PatentTitleYear
10,951,006High-power laser packaging utilizing carbon nanotubes and partially reflective output coupler202110,431,513Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices20199,640,458'Stacked microelectronic devices'20178,823,159'Stacked microelectronic devices'20148,507,318'Method for manufacturing microelectronic devices'20137,557,443'Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2019Patents assigned to MICRON TECHNOLOGY INC (5)· patent assignee history
2009–2019Based in Singapore, SG· patent location history
2013Patents assigned to CHONG CHIN HUI (1)· patent assignee history
2013Patents assigned to LEE CHOON KUAN (1)· patent assignee history
2013Patents assigned to LEE WANG LAI (1)· patent assignee history
2013Patents assigned to SAID ROSLAN BIN (1)· patent assignee history
2021Based in Highlands Ranch, CO, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC52009–2019
CHONG CHIN HUI12013
LEE CHOON KUAN12013
LEE WANG LAIself12013
SAID ROSLAN BIN12013
Locations
LocationPatentsSpan
Singapore, SG52009–2019
Highlands Ranch, CO, US12021