Inventor
Shun Tik Yeung
Inventor
Hong Kong, CN
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H05KPrinted circuits3%
H10DInorganic electric semiconductor devices3%
H10HInorganic light-emitting semiconductor devices having potential barriers3%
PatentTitleYear
11,094,562Semiconductor device and method of manufacture202110,658,274Electronic device202010,529,644Semiconductor device202010,410,941Wafer level semiconductor device with wettable flanks201910,304,759Electronic device and method of making same201910,262,926Reversible semiconductor die201910,256,168Semiconductor device and lead frame therefor20199,947,632Semiconductor device and method of making a semiconductor device20189,640,463'Built-up lead frame package and method of making thereof'20179,391,007'Built-up lead frame QFN and DFN packages and method of making thereof'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016Patents assigned to NXP BV (1)· patent assignee history
2016–2020Based in Hong Kong, CN· patent location history
2017–2021Patents assigned to Nexperia BV (9)· patent assignee history
2019–2021Based in Kwai Chung, HK· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| Nexperia BV | 9 | 2017–2021 |
| NXP BV | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hong Kong, CN | 6 | 2016–2020 |
| Kwai Chung, HK | 4 | 2019–2021 |