Inventor
Michael J. Domitrovits
Inventor
New Paltz, NY, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits21%
H01RElectrically-conductive connections13%
H02HEmergency protective circuit arrangements11%
Y10TTechnical subjects covered by former us classification9%
F04DNon-positive-displacement pumps6%
F05BIndexing scheme relating to wind, spring, weight, inertia or like motors, to machines or engines for liquids covered by subclasses f03b, f03d and f03g6%
G06FElectric digital data processing6%
H02JElectric power networks4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
9,951,785Air-moving assemblies with flywheels20189,933,830Validating power paths to IT equipment20189,727,117'Validating power paths to it equipment'20179,568,011'Air-moving assemblies with flywheels'20179,504,188'Air-moving assembly with auxiliary turbine drive'20169,464,634'Air-moving assemblies with flywheels'20168,424,201'Electronic component for an electronic carrier substrate'20138,106,331'Apparatus for controlling alignment between precision ground plates and method of controlling a desired alignment between opposing precision ground plates'20127,883,266'Method and apparatus for defect detection in a cold plate'20117,791,892'Electronic component for an electronic carrier substrate'20107,758,390'Large array surface mount technology connector cradle assembly'20107,547,231'Large array connector for coupling wafers with a printed circuit board'20097,520,753'Method of using coil contact as electrical interconnect'20097,508,676'Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability'20097,503,110'Method for removing press-fit components from printed circuit boards'20097,088,000'Method and structure to wire electronic devices'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2018Patents assigned to IBM (16)· patent assignee history
2006–2018Based in New Paltz, NY, US· patent location history
2012–2013Patents assigned to DOMITROVITS MICHAEL J (2)· patent assignee history
2012Patents assigned to CONESKI ANTHONY F (1)· patent assignee history
2013Patents assigned to DONNELLY EDWARD J (1)· patent assignee history
2013Patents assigned to FRIZZELL JR RAYMOND F (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 16 | 2006–2018 |
| DOMITROVITS MICHAEL Jself | 2 | 2012–2013 |
| CONESKI ANTHONY F | 1 | 2012 |
| DONNELLY EDWARD J | 1 | 2013 |
| FRIZZELL JR RAYMOND F | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Paltz, New York, US | 16 | 2006–2018 |