Inventor
SHENG-TSUNG HSIAO
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H05KPrinted circuits11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
12,341,081Semiconductor device and manufacturing method thereof202511,996,351Packaged semiconductor device including liquid-cooled lid and methods of forming the same202411,955,405Semiconductor package including thermal interface structures and methods of forming the same202411,901,263Semiconductor device and manufacturing method thereof202411,631,629Semiconductor device and manufacturing method thereof202311,410,910Packaged semiconductor device including liquid-cooled lid and methods of forming the same202211,387,164Semiconductor device and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2025 |