Inventor
YUTARO AOKI
Inventor
JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C07Fprimary
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium19%
C23CCoating metallic material19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
F16KValves7%
F25BRefrigeration machines, plants or systems7%
H01LSemiconductor devices7%
H10DInorganic electric semiconductor devices7%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution7%
C01BNon-metallic elements4%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds4%
PatentTitleYear
12,473,309Organometallic compound and method of manufacturing integrated circuit using the same202512,410,203Organometallic adduct compound and method of manufacturing integrated circuit using the same202512,291,541Compound, thin-film forming raw material, and method of producing thin-film202512,092,380Power element and expansion valve using same202412,061,025Power element and expansion valve using same202411,807,652Tungsten compound, raw material for thin film formation and method for producing thin film202311,466,043Niobium compound and method of forming thin film2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to ADEKA CORP (4)· patent assignee history
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2022–2025Based in JP· patent location history
2024Patents assigned to FUJIKOKI CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADEKA CORP | 4 | 2022–2025 |
| SAMSUNG ELECTRONICS CO LTD | 3 | 2022–2025 |
| FUJIKOKI CORP | 2 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 7 | 2022–2025 |