Inventor
Nobutake Tsuyuno
Inventor
Tokyo, JP
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices19%
H05KPrinted circuits19%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems9%
Y10TTechnical subjects covered by former us classification5%
H10DInorganic electric semiconductor devices3%
B60LPropulsion of electrically-propelled vehicles1%
C08JWorking-up1%
C08LCompositions of macromolecular compounds1%
F02DControlling combustion engines1%
PatentTitleYear
10,818,573Power semiconductor module with heat dissipation plate202010,763,190Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device202010,699,917Resin-sealed vehicle-mounted control device202010,190,563Internal combustion engine ignition coil and method for manufacturing internal combustion engine ignition coil201910,194,563Power conversion device201910,186,473Power module201910,177,084Semiconductor module and method of manufacturing semiconductor module201910,128,164Electronic device and method of manufacturing the electronic device201810,068,880Power module20189,852,962Waterproof electronic device and manufacturing method thereof20179,591,789'Power semiconductor module and power module'20179,497,873'Power module including first and second sealing resins'20169,373,558'Resin-sealed electronic control device'20169,326,425'Power module'20168,952,525'Semiconductor module and method for manufacturing semiconductor module'20158,847,374'Power semiconductor module and manufacturing method thereof'20148,723,306'Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method'20148,653,652'Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module'20148,339,795'Transmission control apparatus and mechanically and electrically integrated type electronic control apparatus'20128,050,037'Electronic control device using LC module structure'20117,899,602'Engine control unit'20117,679,182'Power module and motor integrated control unit'20107,298,039'Electronic circuit device'20077,217,992'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'20077,202,570'Circuit tape having adhesive film semiconductor device and a method for manufacturing the same'20076,888,230'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'20056,791,194'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20046,114,753'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20006,097,100'Resin sealed semiconductor devices and a process for manufacturing the same'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2019Patents assigned to HITACHI LTD (9)· patent assignee history
2000–2007Based in Hitachi, JP· patent location history
2007Based in Chiyoda-ku, JP· patent location history
2010–2016Based in Tokai, JP· patent location history
2012–2020Patents assigned to HITACHI AUTOMOTIVE SYSTEMS LTD (16)· patent assignee history
2012–2016Patents assigned to TSUYUNO NOBUTAKE (6)· patent assignee history
2014–2015Patents assigned to NAKATSU KINYA (4)· patent assignee history
2014–2015Patents assigned to TOKUYAMA TAKESHI (4)· patent assignee history
2014–2015Based in Naka-gun, JP· patent location history
2016–2020Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI AUTOMOTIVE SYSTEMS LTD | 16 | 2012–2020 |
| HITACHI LTD | 9 | 2000–2019 |
| TSUYUNO NOBUTAKEself | 6 | 2012–2016 |
| NAKATSU KINYA | 4 | 2014–2015 |
| TOKUYAMA TAKESHI | 4 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 13 | 2016–2020 |
| Tokai, JP | 6 | 2010–2016 |
| Hitachi, JP | 6 | 2000–2007 |
| Naka-gun, JP | 3 | 2014–2015 |
| Chiyoda-ku, JP | 1 | 2007 |