Inventor
Ankur H. Desai
Inventor
St. Peters, MO, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1036%
B24BMachines, devices, or processes for grinding or polishing18%
G01BMeasuring length, thickness or similar linear dimensions18%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests18%
C30BSingle-crystal growth9%
PatentTitleYear
6,294,469'Silicon wafering process flow'20016,200,908'Process for reducing waviness in semiconductor wafers'20016,030,887'Flattening process for epitaxial semiconductor wafers'20005,787,595'Method and apparatus for controlling flatness of polished semiconductor wafer'19985,422,316'Semiconductor wafer polisher and method'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2001Patents assigned to MEMC ELECTRONIC MATERIALS (3)· patent assignee history
1995–2001Based in St. Peters, MO, US· patent location history
1998Patents assigned to MEMC ELECTRIC MATERIALS INC (1)· patent assignee history
1998Based in St. Charles, MO, US· patent location history
2001Patents assigned to PLASMASIL LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEMC ELECTRONIC MATERIALS | 3 | 1995–2001 |
| MEMC ELECTRIC MATERIALS INC | 1 | 1998 |
| PLASMASIL LLC | 1 | 2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| St. Peters, MO, US | 4 | 1995–2001 |
| St. Charles, MO, US | 1 | 1998 |