Inventor
Shinichiro Inatomi
Inventor
Osaka, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form15%
D04HMaking textile fabrics, e.g. from fibres or filamentary material15%
D10BIndexing scheme associated with sublasses of section d, relating to textiles15%
Y10TTechnical subjects covered by former us classification15%
A01KAnimal husbandry8%
B29CShaping or joining of plastics8%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts8%
D06MTreatment, not provided for elsewhere in class d06, of fibres, threads, yarns, fabrics, feathers or fibrous goods made from such materials8%
D06NWall, floor, or like covering materials, e.g. linoleum, oilcloth, artificial leather, roofing felt, consisting of a fibrous web coated with a layer of macromolecular material8%
PatentTitleYear
11,117,345Nonwoven fabric for reinforcing foam molded articles202110,626,549Resin-coated non-woven fabric202010,266,976Nonwoven fabric for reinforcing foam molded articles and product using same20196,214,461'Modified hydrophobic textile product'20016,173,677'Floor mat for livestock'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2021Patents assigned to TOYO BOSEKI (5)· patent assignee history
2001–2021Based in Osaka, JP· patent location history
2001Based in Ohtsu, JP· patent location history
2020Patents assigned to TOYCO CLOTH CO LTD (1)· patent assignee history
2020Patents assigned to TOYO CLOTH CO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYO BOSEKI | 5 | 2001–2021 |
| TOYCO CLOTH CO LTD | 1 | 2020 |
| TOYO CLOTH CO | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 4 | 2001–2021 |
| Ohtsu, JP | 1 | 2001 |