LexDanaLexDanabeta
Inventor

Ruopeng DENG

Inventor
US

Overview

5→
Patents
2024–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material21%
H10BElectronic memory devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01LSemiconductor devices17%
PatentTitleYear
12,237,221Nucleation-free tungsten deposition202512,077,858Tungsten deposition202412,060,639Rapid flush purging during atomic layer deposition202412,014,928Multi-layer feature fill202411,972,952Atomic layer deposition on 3D NAND structures2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024–2025Patents assigned to LAM RES CORP (5)· patent assignee history
2024–2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LAM RES CORP52024–2025
Locations
LocationPatentsSpan
US52024–2025