Inventor
LI-CHUNG KUO
Inventor
TW
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
12,599,031Semiconductor package and method202612,469,821Packages with multiple types of underfill and method forming the same202512,294,002Integrated circuit package and method of forming same202512,087,733Packages with multiple types of underfill and method forming the same202412,080,617Underfill structure for semiconductor packages and methods of forming the same202412,051,668Semiconductor package and method of forming the same202412,021,008Thermal interface materials, 3D semiconductor packages and methods of manufacture202412,015,023Integrated circuit package and method of forming same202411,990,429Dummy die placement without backside chipping202411,842,936Underfill structure for semiconductor packages and methods of forming the same202311,699,674Semiconductor package and method of forming the same202311,637,086Sawing underfill in packaging processes202311,631,654Sawing underfill in packaging processes202311,621,205Underfill structure for semiconductor packages and methods of forming the same202311,515,267Dummy die placement without backside chipping202211,482,465Thermal interface materials, 3D semiconductor packages and methods of manufacture202211,201,097Method of manufacture of a semiconductor device202111,164,824Package structure and method of fabricating the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (18)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 18 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 18 | 2021–2026 |