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Inventor

Ali Heydari

Inventor
Albany, CA, US

Overview

21→
Patents
2007–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits39%
G06FElectric digital data processing22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
F04DNon-positive-displacement pumps3%
F25BRefrigeration machines, plants or systems3%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%
H01RElectrically-conductive connections3%
H10NElectric solid-state devices not otherwise provided for3%
Y02ATechnologies for adaptation to climate change3%
PatentTitleYear
10,674,635Fan-less chiller-less liquid-air cooling for electronic racks of it components in data centers202010,609,840Modular quick-release liquid heat removal coupling system for electronic racks202010,299,413Modular self-aligning liquid heat removal coupling system for electronic racks201910,238,011Optimal controller for hybrid liquid-air cooling system of electronic racks of a data center201910,162,396Method and system for removing heat using heat removal liquid based on workload of server components of electronic racks201810,136,559Liquid-assisted air cooling of electronic racks with modular fan and heat exchangers20189,848,516Liquid-assisted bottom air cooling of electronic racks in data centers20179,723,759'Cooling servers in a data center using fans external to servers'20179,635,785'Liquid-assisted bottom air cooling of electronic racks in data centers'20179,445,531'Air washing for open air cooling of data centers'20169,198,321'Server chassis bracket'20158,953,329'Server chassis bracket'20158,820,113'Cooling computing devices in a data center with ambient air cooled using heat from the computing devices'20148,522,570'Integrated circuit chip cooling using magnetohydrodynamics and recycled power'20138,474,275'Modular absorption heat sink devices for passive cooling of servers and other electronics'20138,276,394'Modular absorption heat sink devices for passive cooling of servers and other electronics'20127,675,163'Carbon nanotubes for active direct and indirect cooling of electronics device'20107,637,312'Unitary field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components'20097,289,326'Direct contact cooling liquid embedded package for a central processor unit'20077,219,714'Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components'20077,187,550'Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2010Patents assigned to SUN MICROSYSTEMS INC (5)· patent assignee history
2007–2020Based in Albany, CA, US· patent location history
2012–2017Patents assigned to HEYDARI ALI (8)· patent assignee history
2013Based in San Diego, CA, US· patent location history
2014–2017Patents assigned to FACEBOOK INC (2)· patent assignee history
2014–2017Based in Berkeley, CA, US· patent location history
2016–2020Patents assigned to BAIDU USA LLC (9)· patent assignee history
2016Based in El Cerrito, CA, US· patent location history
2017Patents assigned to CUI YAN (2)· patent assignee history
2018Based in Sunnyvale, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BAIDU USA LLC92016–2020
HEYDARI ALIself82012–2017
SUN MICROSYSTEMS INC52007–2010
CUI YAN22017
FACEBOOK INC22014–2017
Locations
LocationPatentsSpan
Albany, California, US162007–2020
Berkeley, California, US22014–2017
Sunnyvale, California, US12018
El Cerrito, California, US12016
San Diego, California, US12013