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Inventor

Hsin-An Shu

Inventor
Hsinchu, TW

Overview

2→
Patents
2016–2021
Patent span
Physics
Primary field (CPC G)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing50%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
10,949,597Through-silicon vias in integrated circuit packaging20219,389,655'Electronic device having fan module with reinforcing structure'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to CHANG HUI-LIAN (1)· patent assignee history
2016Patents assigned to CHEN PAN-JEN (1)· patent assignee history
2016Patents assigned to COMPAL ELECTRONICS INC (1)· patent assignee history
2016Patents assigned to HUNG YI-HSIANG (1)· patent assignee history
2016Patents assigned to LIN MING-WANG (1)· patent assignee history
2016Based in Taipei, TW· patent location history
2021Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANG HUI-LIAN12016
CHEN PAN-JEN12016
COMPAL ELECTRONICS INC12016
HUNG YI-HSIANG12016
LIN MING-WANG12016
Locations
LocationPatentsSpan
Hsinchu, TW12021
Taipei, TW12016