Inventor
Claudius Feger
Inventor
Poughkeepsie, NY, US
Overview
Patents· 51 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
Y10TTechnical subjects covered by former us classification8%
H05KPrinted circuits7%
B23KSoldering or unsoldering6%
G06FElectric digital data processing6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
H10DInorganic electric semiconductor devices3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
11,021,646Nanoparticle design for enhanced oil recovery202110,766,086Injection-molded solder (IMS) tool assembly and method of use thereof202010,444,184Operation of diagnostic devices involving microchannels and electrodes201910,392,555Nanoparticle design for enhanced oil recovery201910,108,762Tunable miniaturized physical subsurface model for simulation and inversion201810,081,015Trapping at least one microparticle20189,962,714Microchannel, microfluidic chip and method for processing microparticles in a fluid flow20189,759,643'Method and integrated device for analyzing liquid flow and liquid-solid interface interaction'20179,310,285'Method and integrated device for analyzing liquid flow and liquid-solid interface interaction'20168,963,340'No flow underfill or wafer level underfill and solder columns'20158,938,627'Multilayer securing structure and method thereof for the protection of cryptographic keys and code'20158,875,978'Forming constant diameter spherical metal balls'20148,820,612'Injection molded solder process for forming solder bumps on substrates'20148,636,931'Vacuum extrusion method of manufacturing a thermal paste'20148,496,159'Injection molded solder process for forming solder bumps on substrates'20138,408,448'Forming constant diameter spherical metal balls'20138,178,153'Heat transfer control structures using thermal phonon spectral overlap'20127,981,849'Reversible thermal thickening grease'20117,951,648'Chip-level underfill method of manufacture'20117,815,968'Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation'20107,776,993'Underfilling with acid-cleavable acetal and ketal epoxy oligomers'20107,773,220'Method and system for collecting alignment data from coated chips or wafers'20107,768,005'Physically highly secure multi-chip assembly'20107,523,852'Solder interconnect structure and method using injection molded solder'20097,516,674'Method and apparatus for thermally induced testing of materials under transient temperature'20097,452,568'Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation'20087,442,049'Electrical connecting device and method of forming same'20087,412,134'Apparatus and methods for remakeable connections to optical waveguides'20087,402,442'Physically highly secure multi-chip assembly'20087,116,865'Apparatus and methods for remakeable connections to optical waveguides'20066,929,900'Tamper-responding encapsulated enclosure having flexible protective mesh structure'20056,924,171'Bilayer wafer-level underfill'20056,919,420'Acid-cleavable acetal and ketal based epoxy oligomers'20056,817,538'Method and system for preventing parallel marketing of wholesale and retail items'20046,746,053'System for preventing parallel marketing of retail items'20046,730,618'Low k dielectric materials with inherent copper ion migration barrier'20046,686,539'Tamper-responding encapsulated enclosure having flexible protective mesh structure'20046,672,759'Method for accounting for clamp expansion in a coefficient of thermal expansion measurement'20046,423,566'Moisture and ion barrier for protection of devices and interconnect structures'20026,414,377'Low k dielectric materials with inherent copper ion migration barrier'20026,403,892'Coated means for connecting a chip and a card'20026,217,185'Efficient backlighting for a portable display'20016,181,554'Portable computer riser for enhanced cooling'20016,130,472'Moisture and ion barrier for protection of devices and interconnect structures'20006,017,682'Solid state extension method'20005,619,357'Flat panel display containing black matrix polymer'19975,546,655'Method of applying flex tape protective coating onto a flex product'19965,382,637'Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases'19955,360,946'Flex tape protective coating'19945,288,842'Morphological composite materials formed from different precursors'19944,846,929'Wet etching of thermally or chemically cured polyimide'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2021Patents assigned to IBM (51)· patent assignee history
1994–2004Based in Hopewell Junction, NY, US· patent location history
2000–2004Based in Croton-on-Hudson, NY, US· patent location history
2004–2021Based in Poughkeepsie, NY, US· patent location history
2012–2015Patents assigned to FEGER CLAUDIUS (7)· patent assignee history
2012–2014Patents assigned to MCGLASHAN-POWELL MAURICE (2)· patent assignee history
2013–2015Patents assigned to NAH JAE-WOONG (4)· patent assignee history
2013–2014Patents assigned to MCLEOD MARK H (2)· patent assignee history
2018–2019Based in Rio de Janeiro, BR· patent location history
2020Based in Yorktown Heights, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 51 | 1989–2021 |
| FEGER CLAUDIUSself | 7 | 2012–2015 |
| NAH JAE-WOONG | 4 | 2013–2015 |
| MCGLASHAN-POWELL MAURICE | 2 | 2012–2014 |
| MCLEOD MARK H | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 30 | 2004–2021 |
| Hopewell Junction, New York, US | 9 | 1994–2004 |
| Croton-on-Hudson, New York, US | 7 | 2000–2004 |
| Rio de Janeiro, BR | 2 | 2018–2019 |
| Yorktown Heights, New York, US | 1 | 2020 |