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Inventor

Chen XIONG

Inventor
CN

Overview

3→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H05KPrinted circuits20%
PatentTitleYear
12,283,559Copper wire bond on gold bump on semiconductor die bond pad202512,108,533Circuit board and method for manufacturing thereof202411,515,275Copper wire bond on gold bump on semiconductor die bond pad2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to TEXAS INSTRUMENTS INC (2)· patent assignee history
2022–2025Based in CN· patent location history
2024Patents assigned to AVARY HOLDING SHENZHEN CO LTD (1)· patent assignee history
2024Patents assigned to GARUDA TECH CO LTD (1)· patent assignee history
2024Patents assigned to QINGDING PREC ELECTRONICS HUAIAN CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TEXAS INSTRUMENTS INC22022–2025
AVARY HOLDING SHENZHEN CO LTD12024
GARUDA TECH CO LTD12024
QINGDING PREC ELECTRONICS HUAIAN CO LTD12024
Locations
LocationPatentsSpan
CN32022–2025