Inventor
Anand Chandrashekar
Inventor
Fremont, CA, US
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
C23CCoating metallic material18%
H01LSemiconductor devices18%
H10BElectronic memory devices8%
H01JElectric discharge tubes or discharge lamps3%
H05HPlasma technique3%
H10DInorganic electric semiconductor devices2%
C23FNon-mechanical removal of metallic material from surface1%
G06FElectric digital data processing1%
PatentTitleYear
11,075,115Tungsten feature fill202111,069,535Atomic layer etch of tungsten for enhanced tungsten deposition fill202110,977,405Fill process optimization using feature scale modeling202110,916,434Feature fill with multi-stage nucleation inhibition202110,760,158Ex situ coating of chamber components for semiconductor processing202010,580,654Feature fill with multi-stage nucleation inhibition202010,580,695Feature fill with nucleation inhibition202010,566,211Continuous and pulsed RF plasma for etching metals202010,395,944Pulsing RF power in etch process to enhance tungsten gapfill performance201910,381,266Tungsten feature fill with nucleation inhibition201910,256,142Tungsten feature fill with nucleation inhibition201910,211,099Chamber conditioning for remote plasma process201910,199,267Tungsten nitride barrier layer deposition201910,170,320Feature fill with multi-stage nucleation inhibition201910,103,058Tungsten feature fill20189,997,405Feature fill with nucleation inhibition20189,978,610Pulsing RF power in etch process to enhance tungsten gapfill performance20189,972,504Atomic layer etching of tungsten for enhanced tungsten deposition fill20189,673,146'Low temperature tungsten film deposition for small critical dimension contacts and interconnects'20179,653,353'Tungsten feature fill'20179,589,835'Method for forming tungsten film having low resistivity, low roughness and high reflectivity'20179,548,228'Void free tungsten fill in different sized features'20179,240,347'Tungsten feature fill'20169,236,297'Low tempature tungsten film deposition for small critical dimension contacts and interconnects'20169,082,826'Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features'20159,034,768'Depositing tungsten into high aspect ratio features'20158,883,637'Systems and methods for controlling etch selectivity of various materials'20148,835,317'Depositing tungsten into high aspect ratio features'20148,623,733'Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects'20148,501,620'Method for depositing tungsten film having low resistivity, low roughness and high reflectivity'20138,435,894'Depositing tungsten into high aspect ratio features'20138,409,987'Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics'20138,153,520'Thinning tungsten layer after through silicon via filling'20128,129,270'Method for depositing tungsten film having low resistivity, low roughness and high reflectivity'20128,124,531'Depositing tungsten into high aspect ratio features'20128,058,170'Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to NOVELLUS SYSTEMS INC (20)· patent assignee history
2011–2015Patents assigned to CHANDRASHEKAR ANAND (10)· patent assignee history
2011–2015Patents assigned to HUMAYUN RAASHINA (10)· patent assignee history
2011–2019Based in Sunnyvale, CA, US· patent location history
2012–2015Patents assigned to DANEK MICHAL (7)· patent assignee history
2014–2021Based in Fremont, CA, US· patent location history
2015–2021Patents assigned to LAM RES CORP (16)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NOVELLUS SYSTEMS INC | 20 | 2011–2021 |
| LAM RES CORP | 16 | 2015–2021 |
| CHANDRASHEKAR ANANDself | 10 | 2011–2015 |
| HUMAYUN RAASHINA | 10 | 2011–2015 |
| DANEK MICHAL | 7 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fremont, California, US | 18 | 2014–2021 |
| Sunnyvale, California, US | 18 | 2011–2019 |