Inventor
Mizuho Ishikawa
Inventor
Kyoto, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H03Fprimary
H03FAmplifiers18%
H04BTransmission18%
B29CShaping or joining of plastics12%
B29DProducing particular articles from plastics or from substances in a plastic state12%
B29LIndexing scheme associated with subclass b29c, relating to particular articles12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
Y10TTechnical subjects covered by former us classification12%
H05KPrinted circuits6%
PatentTitleYear
10,848,105Power amplification module202010,469,033Power amplification module201910,135,398Power amplification module20185,672,365'Die assembly for molding a lead screw'19975,533,247'Method for fabricating a lead screw made of synthetic resin material and having a core tube therein'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–1997Patents assigned to MINEBEA CO LTD (2)· patent assignee history
1996–1997Patents assigned to MOLD GIJUTSU KENKYUSHO KK (2)· patent assignee history
1996–1997Based in Kanagawa, JP· patent location history
2018–2020Patents assigned to MURATA MANUFACTURING CO (3)· patent assignee history
2018–2020Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 3 | 2018–2020 |
| MINEBEA CO LTD | 2 | 1996–1997 |
| MOLD GIJUTSU KENKYUSHO KK | 2 | 1996–1997 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 3 | 2018–2020 |
| Kanagawa, JP | 2 | 1996–1997 |