Inventor
Biswajit Sur
Inventor
San Jose, CA, US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
G02BOptical elements, systems or apparatus18%
G06FElectric digital data processing9%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
G01TMeasurement of nuclear or x-radiation5%
G21CNuclear reactors5%
H05BElectric heating5%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications5%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
PatentTitleYear
10,964,438System and method for stand-off monitoring of nuclear reactors using neutron detection20219,218,041'Adaptive thermal control of electronic devices'20159,176,550'Thermally downward scalable system'20157,242,088'IC package pressure release apparatus and method'20077,220,624'Windowed package for electronic circuitry'20077,174,060'Ultra-thin polarization mode converters based on liquid crystal materials'20077,132,313'Diamond heat spreading and cooling technique for integrated circuits'20067,091,063'Electronic assembly comprising solderable thermal interface and methods of manufacture'20067,065,273'Wideband arrayed waveguide grating'20066,982,192'High performance thermal interface curing process for organic flip chip packages'20066,928,200'Ultra-thin polarization mode converters based on liquid crystal materials'20056,860,642'Compact optical package with modular optical connector'20056,724,078'Electronic assembly comprising solderable thermal interface'20046,667,548'Diamond heat spreading and cooling technique for integrated circuits'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2015Patents assigned to INTEL CORP (13)· patent assignee history
2003–2015Based in San Jose, CA, US· patent location history
2015Patents assigned to DISTEFANO ERIC (1)· patent assignee history
2015Patents assigned to HERMERDING II JAMES G (1)· patent assignee history
2015Patents assigned to MATTER EUGENE P (1)· patent assignee history
2015Based in Santa Clara, CA, US· patent location history
2021Patents assigned to ATOMIC ENERGY OF CANADA LTD / ENERGIE ATOMIQUE DU CANADA LIMITEE (1)· patent assignee history
2021Based in Deep River, CA· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 13 | 2003–2015 |
| ATOMIC ENERGY OF CANADA LTD / ENERGIE ATOMIQUE DU CANADA LIMITEE | 1 | 2021 |
| DISTEFANO ERIC | 1 | 2015 |
| HERMERDING II JAMES G | 1 | 2015 |
| MATTER EUGENE P | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 12 | 2003–2015 |
| Deep River, CA | 1 | 2021 |
| Santa Clara, California, US | 1 | 2015 |