Inventor
Muneharu Morioka
Inventor
Kawasaki, JP
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H10DInorganic electric semiconductor devices16%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
H05KPrinted circuits9%
B29CShaping or joining of plastics4%
B30BPresses in general2%
PatentTitleYear
8,552,542'Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device'20137,556,985'Method of fabricating semiconductor device'20097,064,047'Semiconductor device having a ball grid array and a fabrication process thereof'20066,987,054'Method of fabricating a semiconductor device having a groove formed in a resin layer'20066,881,611'Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device'20056,875,638'Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board'20056,784,542'Semiconductor device having a ball grid array and a fabrication process thereof'20046,700,198'Resin for semiconductor wire'20046,693,029'Method of forming an insulative substrate having conductive filled vias'20046,657,282'Semiconductor device having a ball grid array and a fabrication process thereof'20036,573,600'Multilayer wiring substrate having differential signal wires and a general signal wire in different planes'20036,471,501'Mold for fabricating semiconductor devices'20026,455,920'Semiconductor device having a ball grid array and a fabrication process thereof'20026,396,155'Semiconductor device and method of producing the same'20026,351,031'Semiconductor device and method for manufacturing substrate of the same'20026,348,416'Carrier substrate for producing semiconductor device'20026,339,261'Semiconductor device and process of producing same'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2006Patents assigned to FUJITSU LTD (15)· patent assignee history
2002–2004Patents assigned to SHINKO ELECTRIC IND CO (3)· patent assignee history
2002–2009Based in Kawasaki, JP· patent location history
2009Patents assigned to FUJITSU MICROELECTRONICS LTD (1)· patent assignee history
2013Patents assigned to MORIOKA MUNEHARU (1)· patent assignee history
2013Patents assigned to RENESAS ELECTRONICS CORP (1)· patent assignee history
2013Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 15 | 2002–2006 |
| SHINKO ELECTRIC IND CO | 3 | 2002–2004 |
| FUJITSU MICROELECTRONICS LTD | 1 | 2009 |
| MORIOKA MUNEHARUself | 1 | 2013 |
| RENESAS ELECTRONICS CORP | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 16 | 2002–2009 |
| Kanagawa, JP | 1 | 2013 |