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Inventor

Yoo Sun Kim

Inventor
Daejeon, KR

Overview

2→
Patents
2015–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits29%
B23KSoldering or unsoldering14%
H01LSemiconductor devices14%
H01RElectrically-conductive connections14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
10,172,241Method for packaging flexible device using holding wafer, and flexible device manufactured by the same20199,113,586'Device for bonding flexible PCB to camera module'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015Patents assigned to KAIST KOREA ADVANCED INST OF SCIENCE AND TECHNOLOGY (1)· patent assignee history
2015Patents assigned to LG INNOTEK CO LTD (1)· patent assignee history
2015–2019Based in Daejeon, KR· patent location history
2019Patents assigned to KOREA ADVANCED INST SCI & TECH (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KAIST KOREA ADVANCED INST OF SCIENCE AND TECHNOLOGY12015
KOREA ADVANCED INST SCI & TECH12019
LG INNOTEK CO LTD12015
Locations
LocationPatentsSpan
Daejeon, KR22015–2019