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Inventor

Yukihiro Ikeya

Inventor
Yokohama, JP

Overview

3→
Patents
2001–2018
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering33%
B24BMachines, devices, or processes for grinding or polishing17%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution17%
PatentTitleYear
9,937,600Surface treatment apparatus, and surface treatment method20189,853,279Battery and ultrasonic bonding method for battery20176,193,132'Method for bonding semiconductor chip and device therefor'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2018Patents assigned to TOSHIBA KK (3)· patent assignee history
2001–2018Based in Yokohama, JP· patent location history
2017Patents assigned to AIZAWA TAKAHIRO (1)· patent assignee history
2017Patents assigned to IKEYA YUKIHIRO (1)· patent assignee history
2017Patents assigned to TOMIOKA TAIZO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK32001–2018
AIZAWA TAKAHIRO12017
IKEYA YUKIHIROself12017
TOMIOKA TAIZO12017
Locations
LocationPatentsSpan
Yokohama, JP32001–2018