Inventor
Chung-Hsien Lin
Inventor
Hsinchu, TW
Overview
Patents· 58 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices23%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
H01LSemiconductor devices7%
H10DInorganic electric semiconductor devices7%
Y10TTechnical subjects covered by former us classification5%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
H02NElectric machines not otherwise provided for2%
B23PMetal-working not otherwise provided for1%
PatentTitleYear
10,816,422Pressure sensor202010,712,218Pressure sensor202010,457,550MEMS devices and methods of forming same201910,254,185Pressure sensor201910,161,817Reduced stress pressure sensor201810,160,633MEMS devices and fabrication methods thereof201810,155,655MEMS devices and fabrication methods thereof201810,134,552Method for fabricating MEMS switch with reduced dielectric charging effect201810,099,919MEMS devices and methods of forming same201810,087,069Semiconductor devices with moving members and methods for making the same20189,958,349Pressure sensor20189,873,610Multiple bonding in wafer level packaging20189,625,822'Mechanisms for performing a photolithography process with a surface modifying treatment on an exposed photoresist layer'20179,623,597'Gate structure of open-chamber hot-runner mold'20179,617,147'Dual layer microelectromechanical systems device and method of manufacturing same'20179,586,811'Semiconductor devices with moving members and methods for making the same'20179,581,512'Pressure sensor with deformable membrane and method of manufacture'20179,550,666'MEMS device with release aperture'20179,499,396'MEMS devices and methods of forming same'20169,452,924'MEMS devices and fabrication methods thereof'20169,450,109'MEMS devices and fabrication methods thereof'20169,337,168'Hermetic wafer level packaging'20169,140,578'Measurement device'20159,134,141'Measurement device'20159,133,017'MEMS structure with adaptable inter-substrate bond'20159,006,015'Dual layer microelectromechanical systems device and method of manufacturing same'20158,987,059'MEMS devices and methods of forming same'20158,962,367'MEMS device with release aperture'20158,887,573'MEMS vacuum level monitor in sealed package'20148,797,127'MEMS switch with reduced dielectric charging effect'20148,763,220'Method of manufacturing a MEMS device'20148,748,205'MEMS structure with adaptable inter-substrate bond'20148,729,646'MEMS devices and methods for forming the same'20148,716,051'MEMS device with release aperture'20148,709,849'Wafer level packaging'20148,704,317'Microstructure device with an improved anchor'20148,648,468'Hermetic wafer level packaging'20148,633,554'MEMS device etch stop'20148,629,517'Wafer level packaging'20148,569,808'Temperature stabilitized MEMS'20138,551,798'Microstructure with an enhanced anchor'20138,525,278'MEMS device having chip scale packaging'20138,486,744'Multiple bonding in wafer level packaging'20138,455,982'Overlay mark enhancement feature'20138,410,665'MEMS kinetic energy conversion'20138,368,152'MEMS device etch stop'20138,343,789'Microstructure device with an improved anchor'20138,330,559'Wafer level packaging'20128,232,614'Package systems having a conductive element through a substrate thereof and manufacturing methods of the same'20128,148,232'Overlay mark enhancement feature'20127,986,600'Optical recording apparatus and method for optimizing recording signal'20117,855,491'Prestress-adjustable piezoelectric gripping device'20106,924,583'Film bulk acoustic device with integrated tunable and trimmable device'20056,810,202'Apparatus for controlling rotational speed of motor'20046,737,860'System for controlling rotational speed of fan according to reference clock frequency'20046,317,673'Electrical apparatus for assisting mechanical braking in a motor cycle'20016,244,175'Single space rotary printing press for newspapers'20016,244,182'Anti-expansion web-transfer mechanism for a color press'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2011Based in Taipei, TW· patent location history
2005–2020Based in Hsinchu, TW· patent location history
2012–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (27)· patent assignee history
2012–2017Patents assigned to LIN CHUNG-HSIEN (19)· patent assignee history
2012–2017Patents assigned to CHU CHIA-HUA (15)· patent assignee history
2012–2014Patents assigned to CHENG CHUN-WEN (8)· patent assignee history
2015Based in Zhongli City, TW· patent location history
2015Based in Zhongli, Taoyuan County, TW· patent location history
2016–2019Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
2017Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 27 | 2012–2016 |
| LIN CHUNG-HSIENself | 19 | 2012–2017 |
| CHU CHIA-HUA | 15 | 2012–2017 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 14 | 2016–2019 |
| CHENG CHUN-WEN | 8 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 48 | 2005–2020 |
| Taipei, TW | 5 | 2001–2011 |
| Taichung, TW | 1 | 2017 |
| Zhongli City, TW | 1 | 2015 |
| Zhongli, Taoyuan County, TW | 1 | 2015 |