Inventor
HUI KIN LIT
Inventor
MY
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,080,625Semiconductor package with releasable isolation layer protection202411,804,424Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip202311,791,238Semiconductor package with releasable isolation layer protection2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2024Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (3)· patent assignee history
2023–2024Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AUSTRIA AG | 3 | 2023–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 3 | 2023–2024 |