Inventor
Arvind K. Sinha
Inventor
Rochester, MN, US
Overview
Patents· 110 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10TTechnical subjects covered by former us classification12%
H01RElectrically-conductive connections7%
H01LSemiconductor devices7%
G06FElectric digital data processing6%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
B23KSoldering or unsoldering2%
B82YSpecific uses or applications of nanostructures2%
PatentTitleYear
10,902,394One line in-context user interface202110,644,451Dynamic keying assembly202010,553,992Dynamic keying assembly202010,546,828Ball grid array rework202010,295,270Demand-based charging of a heat pipe201910,169,499Thermoset resin flow models for printed circuit board laminates201910,156,403Demand-based charging of a heat pipe201810,126,070Demand-based charging of a heat pipe201810,004,161Electronic module with laterally-conducting heat distributor layer20189,978,706Ball grid array rework20189,976,812Dual magnetically coupled rotor heat exchanger20189,954,338Dynamic keying assembly20189,921,619'Method for containing computer system components'20189,907,185'Method of affixing a group of elastic filaments to an electronic component body'20189,863,712'Demand-based charging of a heat pipe'20189,853,375Pin attach converter20179,843,152'Dynamic keying assembly'20179,835,384Demand-based charging of a heat pipe20179,726,837'Light pipe connector apparatus'20179,721,855'Alignment of three dimensional integrated circuit components'20179,619,774'Product tracking system'20179,609,744'Area array device connection structures with complimentary warp characteristics'20179,590,329'Pin attach converter'20179,523,432'Air valve for electronics enclosures'20169,508,614'Alignment of three dimensional integrated circuit components'20169,494,752'Dual optical and electrical LGA contact'20169,482,833'Light pipe connector apparatus'20169,482,349'Air valve for electronics enclosures'20169,414,528'Thermal spreading for an externally pluggable electronic module'20169,414,527'Thermal spreading for an externally pluggable electronic module'20169,414,526'Cooling apparatus with dynamic load adjustment'20169,392,731'Cooling apparatus with dynamic load adjustment'20169,389,379'Dual optical and electrical LGA contact'20169,338,885'Ball grid array rework'20169,332,639'Ball grid array rework'20169,326,386'Computer system component bay'20169,299,686'Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars'20169,301,430'Electronic module with laterally-conducting heat distributor layer'20169,299,591'Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars'20169,277,677'Cooling an electronic device using a thermally conductive loop'20169,265,179'Continuous loop cooling for an electronic device'20169,257,359'System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks'20169,252,525'Sealing connector to mitigate corrosion'20169,245,813'Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance'20169,247,636'Area array device connection structures with complimentary warp characteristics'20169,177,889'Implementing microscale thermoacoustic heat and power control for processors and 3D chipstacks'20159,170,056'Duplex flexible heat exchanger'20159,111,899'Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks'20159,096,784'Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance'20158,961,280'Method of manufacturing a venting device for tamper resistant electronic modules'20158,958,214'Motherboard assembly for interconnecting and distributing signals and power'20158,952,258'Implementing graphene interconnect for high conductivity applications'20158,941,398'Heat spreader flatness detection'20158,911,244'Receptacle with heat management for electronic and optical systems'20148,779,585'Implementing enhanced thermal conductivity in stacked modules'20148,750,704'Implementing reduced signal degradation for fiber optic modules'20148,716,597'Implementing enhanced dimensional stability with graphite nanotube hybrid socket'20148,705,050'Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer'20148,611,090'Electronic module with laterally-conducting heat distributor layer'20138,558,564'Heat spreader flatness detection'20138,550,840'Plug and receptacle arrangement with connection sensor'20138,544,337'Piezoelectric chromic impact sensor'20138,446,738'Motherboard assembly for interconnecting and distributing signals and power'20138,431,048'Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance'20138,432,034'Use of a local constraint to enhance attachment of an IC device to a mounting platform'20138,289,712'Flux-free detachable thermal interface between an integrated circuit device and a heat sink'20128,287,336'Method of manufacturing a venting device for tamper resistant electronic modules'20127,944,698'Mounting a heat sink in thermal contact with an electronic component'20117,929,314'Method and apparatus of changing PCB pad structure to increase solder volume and strength'20117,903,411'Cold plate stability'20117,832,096'Method for producing an organic substrate with integral thermal dissipation channels'20107,777,329'Heatsink apparatus for applying a specified compressive force to an integrated circuit device'20107,751,918'Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates'20107,701,720'Electronic assembly and techniques for installing a heatsink in an electronic assembly'20107,632,127'Socket and method for compensating for differing coefficients of thermal expansion'20097,606,033'Mounting a heat sink in thermal contact with an electronic component'20097,550,840'Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof'20097,535,714'Apparatus and method providing metallic thermal interface between metal capped module and heat sink'20097,530,853'Socket and method for compensating for differing coefficients of thermal expansion'20097,499,279'Cold plate stability'20097,486,516'Mounting a heat sink in thermal contact with an electronic component'20097,472,477'Method for manufacturing a socket that compensates for differing coefficients of thermal expansion'20097,442,053'Apparatus for restricting rotational moment about a longitudinal axis of SMT connectors'20087,438,558'Three-dimensional stackable die configuration for an electronic circuit board'20087,438,557'Stacked multiple electronic component interconnect structure'20087,382,620'Method and apparatus for optimizing heat transfer with electronic components'20087,354,281'Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors'20087,352,575'Dynamic air moving system'20087,339,266'Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof'20087,317,514'System and method for optimizing heat management'20087,303,443'Socket and method for compensating for differing coefficients of thermal expansion'20077,298,623'Organic substrate with integral thermal dissipation channels, and method for producing same'20077,214,874'Venting device for tamper resistant electronic modules'20077,087,210'Single-step simple and economical process for the preparation of nanosized acicular magnetic iron oxide particles of maghemite phase'20067,071,720'Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit'20067,068,510'Dissipating heat reliably in computer systems'20066,988,533'Method and apparatus for mounting a heat transfer apparatus upon an electronic component'20066,970,360'Tamper-proof enclosure for a circuit card'20056,802,733'Topside installation apparatus for land grid array modules'20046,800,271'Process for the preparation of nanosized iron oxide by biomimetic route'20046,792,375'Apparatus, system, and method of determining loading characteristics on an integrated circuit module'20046,757,965'Method of installing a land grid array multi-chip modules'20046,718,269'Apparatus, program product and method of estimating the stress intensity factor ratio of a material'20046,634,095'Apparatus for mounting a land grid array module'20036,568,250'Apparatus and method for determining residual stress'20036,534,964'Apparatus and method for determining stiffness properties of an anisotropic electronic substrate using scanning acoustic microscopy'20036,475,011'Land grid array socket actuation hardware for MCM applications'20026,449,155'Land grid array subassembly for multichip modules'20026,427,536'Method and system for measuring anisotropic material properties'20026,385,044'Heat pipe heat sink assembly for cooling semiconductor chips'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2020Patents assigned to IBM (103)· patent assignee history
2002–2020Based in Rochester, MN, US· patent location history
2004Based in Jamshedpur, IN· patent location history
2006Based in Jharkhand, IN· patent location history
2012–2016Patents assigned to SINHA ARVIND K (13)· patent assignee history
2012–2017Patents assigned to SINHA ARVIND KUMAR (7)· patent assignee history
2013–2016Patents assigned to KUCZYNSKI JOSEPH (6)· patent assignee history
2016Patents assigned to GLOBALFOUNDRIES INC (3)· patent assignee history
2017–2019Based in Los Alamos, NM, US· patent location history
2021Based in San Jose, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 103 | 2002–2020 |
| SINHA ARVIND Kself | 13 | 2012–2016 |
| SINHA ARVIND KUMARself | 7 | 2012–2017 |
| KUCZYNSKI JOSEPH | 6 | 2013–2016 |
| GLOBALFOUNDRIES INC | 3 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Rochester, Minnesota, US | 105 | 2002–2020 |
| Los Alamos, NM, US | 2 | 2017–2019 |
| San Jose, California, US | 1 | 2021 |
| Jharkhand, IN | 1 | 2006 |
| Jamshedpur, IN | 1 | 2004 |