Inventor
Takashi Ichiryu
Inventor
Osaka, JP
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H05KPrinted circuits16%
Y10TTechnical subjects covered by former us classification10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y02PClimate change mitigation technologies in the production or processing of goods9%
H10KOrganic electric solid-state devices8%
H10DInorganic electric semiconductor devices7%
H01LSemiconductor devices5%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%
B23KSoldering or unsoldering2%
PatentTitleYear
11,062,981Bidirectional switch and bidirectional switch device including the switch202110,228,806Flexible touch sensor and method of manufacturing the same201910,083,889Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same20189,860,979'Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer'20189,844,133'Flexible substrate including stretchable sheet'20179,812,385'Electronic component package including electronic component, metal member, and sealing resin'20179,330,811'Transparent electrode and method for manufacturing the same'20168,691,683'Flip-chip mounting method and bump formation method'20148,617,943'Method for making a semiconductor device on a flexible substrate'20138,525,172'Flexible semiconductor device'20138,525,178'Flexible semiconductor device and method for producing the same'20138,367,488'Manufacturing method of flexible semiconductor device'20138,343,822'Flexible semiconductor device and method for manufacturing same'20138,283,246'Flip chip mounting method and bump forming method'20128,071,425'Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus'20118,064,213'Module with a built-in component, and electronic device with the same'20117,981,528'Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same'20117,977,741'Manufacturing method of flexible semiconductor device and flexible semiconductor device'20117,951,700'Flip chip mounting method and bump forming method'20117,927,997'Flip-chip mounting method and bump formation method'20117,910,403'Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same'20117,875,496'Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body'20117,851,281'Manufacturing method of flexible semiconductor device and flexible semiconductor device'20107,773,386'Flexible substrate, multilayer flexible substrate'20107,754,529'Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method'20107,748,110'Method for producing connection member'20107,732,920'Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus'20107,726,545'Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei'20107,531,754'Flexible substrate having interlaminar junctions, and process for producing the same'20097,321,496'Flexible substrate, multilayer flexible substrate and process for producing the same'20087,258,549'Connection member and mount assembly and production method of the same'20077,242,823'Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus'20077,205,483'Flexible substrate having interlaminar junctions, and process for producing the same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2021Based in Osaka, JP· patent location history
2007–2011Based in Moriguchi, JP· patent location history
2009–2021Patents assigned to PANASONIC CORP (24)· patent assignee history
2011–2014Patents assigned to ICHIRYU TAKASHI (8)· patent assignee history
2011–2014Patents assigned to NAKATANI SEIICHI (8)· patent assignee history
2013–2014Patents assigned to HIRANO KOICHI (5)· patent assignee history
2016–2019Patents assigned to PANASONIC IP MAN CO LTD (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC CORP | 24 | 2009–2021 |
| ICHIRYU TAKASHIself | 8 | 2011–2014 |
| NAKATANI SEIICHI | 8 | 2011–2014 |
| HIRANO KOICHI | 5 | 2013–2014 |
| PANASONIC IP MAN CO LTD | 5 | 2016–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 26 | 2007–2021 |
| Moriguchi, JP | 7 | 2007–2011 |