Inventor
Iwona Turlik
Inventor
Raleigh, NC, US
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
G01RMeasuring electric variables7%
G02BOptical elements, systems or apparatus7%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification7%
B23KSoldering or unsoldering5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
A61BDiagnosis2%
A61FFilters implantable into blood vessels2%
PatentTitleYear
7,206,044'Display and solar cell device'20076,829,502'Brain response monitoring apparatus and method'20046,730,056'Eye implant for treating glaucoma and method for manufacturing same'20046,285,899'Remotely interrogated biomedical sensor'20016,194,250'Low-profile microelectronic package'20016,049,463'Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same'20005,923,796'Microelectronic module having optical and electrical interconnects'19995,844,315'Low-profile microelectronic package'19985,638,469'Microelectronic module having optical and electrical interconnects'19975,447,264'Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon'19955,381,946'Method of forming differing volume solder bumps'19955,374,893'Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon'19945,325,265'High performance integrated circuit chip package'19945,289,631'Method for testing, burn-in, and/or programming of integrated circuit chips'19945,237,434'Microelectronic module having optical and electrical interconnects'19935,168,078'Method of making high density semiconductor structure'19925,145,714'Metal-organic chemical vapor deposition for repairing broken lines in microelectronic packages'19925,025,304'High density semiconductor structure and method of making the same'19915,009,360'Metal-to-metal bonding method and resulting structure'19914,483,541'Gas seal for semiconductor processing equipment'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1984–1994Patents assigned to NORTHERN TELECOM LTD (5)· patent assignee history
1984Based in Nepean, CA· patent location history
1991–1999Patents assigned to MCNC (12)· patent assignee history
1991–1999Based in Raleigh, NC, US· patent location history
1994Patents assigned to IBM (1)· patent assignee history
1997–1999Patents assigned to UNIV NORTH CAROLINA (2)· patent assignee history
1998–2007Based in Barrington, IL, US· patent location history
2000–2007Patents assigned to MOTOROLA INC (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MCNC | 12 | 1991–1999 |
| MOTOROLA INC | 6 | 2000–2007 |
| NORTHERN TELECOM LTD | 5 | 1984–1994 |
| UNIV NORTH CAROLINA | 2 | 1997–1999 |
| IBM | 1 | 1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Raleigh, NC, US | 12 | 1991–1999 |
| Barrington, Illinois, US | 7 | 1998–2007 |
| Nepean, CA | 1 | 1984 |