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Inventor

Ching-Wei Hung

Inventor
Hsinchu, TW

Overview

2→
Patents
2011–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
B23KSoldering or unsoldering20%
B41MPrinting, duplicating, marking, or copying processes20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
8,159,063'Substrate and package with micro BGA configuration'20127,884,472'Semiconductor package having substrate ID code and its fabricating method'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2012Patents assigned to POWERTECH TECHNOLOGY INC (2)· patent assignee history
2011–2012Based in Hsinchu, TW· patent location history
2012Patents assigned to HUNG CHING-WEI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
POWERTECH TECHNOLOGY INC22011–2012
HUNG CHING-WEIself12012
Locations
LocationPatentsSpan
Hsinchu, TW22011–2012