Inventor
KEITARO HASHIZUME
Inventor
JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics25%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering25%
B22FWorking metallic powder13%
B25JManipulators8%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
B28BShaping clay or other ceramic compositions4%
F16HGearing4%
H01RElectrically-conductive connections4%
PatentTitleYear
12,583,184Three-dimensional modeling apparatus202612,539,668Molding stage and three-dimensional molding apparatus202612,486,886Torque transmission mechanism202512,447,671Three-dimensional shaping method202512,358,233Three-dimensional shaping device202512,145,321Three-dimensional shaping device202412,115,732Three-dimensional shaping nozzle with scratch-forming target member202411,759,948Robot202311,518,049Rotary module and robot2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SEIKO EPSON CORP (9)· patent assignee history
2022–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEIKO EPSON CORP | 9 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 9 | 2022–2026 |