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Inventor

Chin Nguk Lai

Inventor
Hsinchu, TW

Overview

2→
Patents
2016–2021
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form20%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds20%
C09JAdhesives20%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
10,947,417Thermal-curable adhesive composition and adhesive sheet20219,431,364'Multi-chip package assembly with improved bond wire separation'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to CYPESS SEMICONDUCTOR CORP (1)· patent assignee history
2016Patents assigned to CYPRESS SEMICONDUCTOR CORP (1)· patent assignee history
2016Based in Bayan Lepas, MY· patent location history
2021Patents assigned to TAIMIDE TECH INC (1)· patent assignee history
2021Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CYPESS SEMICONDUCTOR CORP12016
CYPRESS SEMICONDUCTOR CORP12016
TAIMIDE TECH INC12021
Locations
LocationPatentsSpan
Hsinchu, TW12021
Bayan Lepas, MY12016