Inventor
Dae Young Jung
Inventor
Lagrangeville, NY, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H04NPictorial communication, e.g. television19%
G06FElectric digital data processing12%
C23CCoating metallic material9%
H05KPrinted circuits9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry2%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
C09DCoating compositions, e.g. paints, varnishes or lacquers2%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them2%
PatentTitleYear
10,270,948Substrate for camera module and camera module having the same20199,594,437'Digital broadcast receiver controlled by screen remote controller and space remote controller and controlling method thereof'20179,529,453'Digital broadcast receiver controlled by screen remote controller and space remote controller and controlling method thereof'20169,237,296'Image display apparatus and operating method thereof'20169,124,918'Digital broadcast receiver controlled by screen remote controller and space remote controller and controlling method thereof'20158,826,341'Digital broadcast receiver controlled by screen remote controller and space remote controller and controlling method thereof'20148,535,808'Heat dissipation coating agent and heat-dissipating plate including same'20138,494,158'Method of downloading software in digital broadcast receiver'20137,919,356'Method and structure to reduce cracking in flip chip underfill'20117,867,887'Structure and method for enhancing resistance to fracture of bonding pads'20117,701,035'Laser fuse structures for high power applications'20107,648,891'Semiconductor chip shape alteration'20107,573,115'Structure and method for enhancing resistance to fracture of bonding pads'20097,566,637'Method of inhibition of metal diffusion arising from laser dicing'20097,479,447'Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses'20097,221,410'Television receiving module and display apparatus and television receiving system using the same'20076,815,346'Unique feature design enabling structural integrity for advanced low k semiconductor chips'20046,650,010'Unique feature design enabling structural integrity for advanced low K semiconductor chips'20034,967,690'Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means'19904,904,506'Copper deposition from electroless plating bath'19904,869,930'Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization'19894,684,545'Electroless plating with bi-level control of dissolved oxygen'19874,593,016'Process for manufacturing a concentrate of a palladium-tin colloidal catalyst'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2011Patents assigned to IBM (14)· patent assignee history
1986–1990Based in Endwell, NY, US· patent location history
2003–2011Based in Lagrangeville, NY, US· patent location history
2007–2019Patents assigned to SAMSUNG ELECTRO MECH (2)· patent assignee history
2009–2011Based in Vestal, NY, US· patent location history
2013–2017Patents assigned to LG ELECTRONICS INC (6)· patent assignee history
2013–2016Patents assigned to JUNG DAE YOUNG (3)· patent assignee history
2013Patents assigned to AHN MYEONG-SANG (1)· patent assignee history
2013–2017Based in Seoul, KR· patent location history
2019Based in Suwon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 14 | 1986–2011 |
| LG ELECTRONICS INC | 6 | 2013–2017 |
| JUNG DAE YOUNGself | 3 | 2013–2016 |
| SAMSUNG ELECTRO MECH | 2 | 2007–2019 |
| AHN MYEONG-SANG | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Lagrangeville, New York, US | 7 | 2003–2011 |
| Seoul, KR | 6 | 2013–2017 |
| Endwell, New York, US | 5 | 1986–1990 |
| Vestal, New York, US | 2 | 2009–2011 |
| Suwon-si, KR | 1 | 2019 |