Inventor
Kenji Sasaoka
Inventor
Zama, JP
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits32%
Y10TTechnical subjects covered by former us classification26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y02PClimate change mitigation technologies in the production or processing of goods12%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
H10DInorganic electric semiconductor devices4%
H01LSemiconductor devices2%
H01PWaveguides2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
8,987,901'Component built-in wiring board and manufacturing method of component built-in wiring board'20158,737,085'Wiring board with a built-in component and method for manufacturing the same'20148,350,388'Component built-in wiring board and manufacturing method of component built-in wiring board'20138,198,541'Electronic component built-in wiring board and method for radiating heat generated at the same'20127,644,497'Component built-in wiring board and manufacturing method of component built-in wiring board'20107,526,859'Apparatus for manufacturing a wiring board'20097,345,888'Component built-in wiring board and manufacturing method of component built-in wiring board'20087,242,591'Wiring board incorporating components and process for producing the same'20077,134,193'Method for manufacturing a wiring board'20066,865,801'Apparatus for manufacturing a wiring board'20056,534,873'Semiconductor package and printed wiring board for semiconductor package'20036,507,995'Apparatus for manufacturing a wiring substrate'20036,353,189'Wiring board, wiring board fabrication method, and semiconductor package'20026,010,769'Multilayer wiring board and method for forming the same'20005,822,850'Circuit devices and fabrication Method of the same'19985,600,103'Circuit devices and fabrication method of the same'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2005Patents assigned to TOSHIBA KK (7)· patent assignee history
1997–2009Based in Zama, JP· patent location history
2002–2015Based in Tokyo, JP· patent location history
2003Based in Machida, JP· patent location history
2006–2015Patents assigned to DAINIPPON PRINTING CO LTD (9)· patent assignee history
2007–2010Based in Fuchu, JP· patent location history
2012–2015Patents assigned to SASAOKA KENJI (4)· patent assignee history
2012Patents assigned to FUKUOKA YOSHITAKA (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DAINIPPON PRINTING CO LTD | 9 | 2006–2015 |
| TOSHIBA KK | 7 | 1997–2005 |
| SASAOKA KENJIself | 4 | 2012–2015 |
| FUKUOKA YOSHITAKA | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Zama, JP | 7 | 1997–2009 |
| Tokyo, JP | 5 | 2002–2015 |
| Fuchu, JP | 3 | 2007–2010 |
| Machida, JP | 1 | 2003 |