Inventor
CHIH-HSUAN TAI
Inventor
TW
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H10DInorganic electric semiconductor devices6%
G02BOptical elements, systems or apparatus3%
G06VImage or video recognition or understanding2%
H01GCapacitors2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
PatentTitleYear
12,557,707Method of fabricating package structure202612,512,372Semiconductor structure with testing pads and method of manufacturing thereof202512,500,200Package structure with conductive patterns in a redistribution layer202512,469,768Semiconductor package structure and method for forming the same202512,431,446Package structure202512,362,274Package structure and method of forming the same202512,334,434Package structure and method of forming the same202512,278,208Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer202512,222,545Package and method of forming same202512,205,860Sensor packages202512,125,810Delamination sensor202412,100,682Package structure with conductive patterns in a redistribution layer202412,068,212Package structure with through via extending through redistribution layer and method of manufacturing the same202412,015,017Package structure, package-on-package structure and method of fabricating the same202412,009,322Package structure with through-via in molding compound and dielectric layer202411,929,318Package structure and method of forming the same202411,855,232Semiconductor package and forming method thereof202311,847,852Manufacturing method of fingerprint sensor202311,848,300Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer202311,842,993Semiconductor device with multiple polarity groups202311,749,582Package structure202311,742,254Sensor package and method202311,635,566Package and method of forming same202311,631,658Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device202311,616,029Delamination sensor202311,614,592Semiconductor devices and methods of manufacture202311,580,767Fingerprint sensor202311,527,525Semiconductor device with multiple polarity groups202211,444,002Package structure202211,424,213Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure202211,374,136Semiconductor package and forming method thereof202211,322,421Package structure and method of forming the same202211,309,225Fan-out package structure and method of manufacturing the same202211,251,141Package structure202211,158,555Package structure having sensor die with touch sensing electrode, and method of fabricating the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (35)· patent assignee history
2021–2026Based in TW· patent location history
2024Patents assigned to TAIWAN SEMICONDUTOR MFG COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 35 | 2021–2026 |
| TAIWAN SEMICONDUTOR MFG COMPANY LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 35 | 2021–2026 |