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Inventor

Bing-Siang Chen

Inventor
Taipei, TW

Overview

3→
Patents
2014–2016
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
PatentTitleYear
9,305,843'Chip package and method for forming the same'20168,878,367'Substrate structure with through vias'20148,836,134'Semiconductor stacked package and method of fabricating the same'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2016Patents assigned to XINTEC INC (3)· patent assignee history
2014Patents assigned to CHEN BING-SIANG (2)· patent assignee history
2014Patents assigned to CHEN CHIEN-HUI (2)· patent assignee history
2014Patents assigned to CHIANG CHEN-HAN (1)· patent assignee history
2014Patents assigned to HO YEN-SHIH (1)· patent assignee history
2014–2016Based in Taipei, TW· patent location history
2014Based in Jhubei City, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
XINTEC INC32014–2016
CHEN BING-SIANGself22014
CHEN CHIEN-HUI22014
CHIANG CHEN-HAN12014
HO YEN-SHIH12014
Locations
LocationPatentsSpan
Taipei, TW22014–2016
Jhubei City, TW12014