Inventor
Peng Wang
Inventor
Beijing, CN
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing11%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes11%
H01JElectric discharge tubes or discharge lamps11%
H01LSemiconductor devices11%
H04NPictorial communication, e.g. television11%
H04WWireless communication networks11%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
10,970,206Flash data compression decompression method and apparatus202110,939,165Facilitating television based interaction with social networking tools202110,930,564Metal gate structure cutting process202110,903,039Vacuum condition processing apparatus, system and method for specimen observation20219,635,591'Wireless communication method and wireless terminal'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017Patents assigned to HUAWEI DEVICE CO LTD (1)· patent assignee history
2017–2021Based in Beijing, CN· patent location history
2021Patents assigned to INTEL CORP (2)· patent assignee history
2021Patents assigned to FOCUS EBEAM TECH BEIJING CO LTD (1)· patent assignee history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2021Based in Shanghai, CN· patent location history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 2 | 2021 |
| FOCUS EBEAM TECH BEIJING CO LTD | 1 | 2021 |
| HUAWEI DEVICE CO LTD | 1 | 2017 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 3 | 2017–2021 |
| Shanghai, CN | 1 | 2021 |
| Hsinchu, TW | 1 | 2021 |