Inventor
Weiping Wang
Inventor
Palo Alto, CA, US
Overview
Patents· 57 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H03Fprimary
H03FAmplifiers8%
H04BTransmission8%
H03GControl of amplification7%
B29CShaping or joining of plastics6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G06FElectric digital data processing5%
F16LPipes4%
H04MTelephonic communication4%
H04WWireless communication networks4%
A61BDiagnosis4%
PatentTitleYear
11,085,682One method to mitigate vibration and sound level in heat pump chiller with evi function202110,643,962World band radio frequency front end module, system and method of power sensing thereof202010,631,366Handy base station system, device and method202010,542,736Large-scale and high-efficiency fly maggot culturing equipment and process202010,437,295Personal cloud case cover with a plurality of modular capabilities201910,159,430Personal cloud with a plurality of modular capabilities201810,027,287World band frequency front end module, system and method thereof201810,019,102Touch screen and terminal20189,727,721'Method and device for unlocking electronic equipment and unlocking key thereof'20179,671,835'Personal cloud case cover with a plurality of modular capabilities'20179,554,751'Personal cloud with a plurality of modular capabilities'20179,515,615'World band radio frequency front end module, system and method thereof'20169,207,715'Personal cloud with a plurality of modular capabilities'20159,178,555'World band radio frequency front end module, system and method thereof'20159,086,847'Personal cloud case cover with a plurality of modular capabilities'20157,866,968'Reusable inversion sleeve assembly for inversion of cured in place liners'20117,857,932'Cured in place liner with everted outer impermeable layer and method of manufacture'20107,766,048'Installation of cured in place liners with air and flow-through steam to cure'20107,741,710'Module with multiple power amplifiers and power sensors'20107,659,252'Transdermal delivery peptides and method of use thereof'20107,493,094'Multi-mode power amplifier module for wireless communication devices'20097,477,204'Printed circuit board based smart antenna'20097,360,559'Steam cure of cured in place liner'20087,348,842'Multi-substrate RF module for wireless communication devices'20087,253,681'Power amplifier with integrated sensors'20077,238,251'Method of preparing cured in place liner using resin impregnation tower'20077,221,225'Dual band power amplifier module for wireless communication devices'20077,164,314'Power amplifier module for wireless communication devices'20077,148,752'Integrated power amplifier module with power sensor'20067,129,986'Wireless camera system'20067,126,973'One dimensional all-metal slab waveguide gas laser'20067,122,262'Miniature fuel cell system having integrated fuel processor and electronic devices'20067,123,088'Power amplifier module for wireless communication devices'20067,108,456'Steam cure of cured in place liner'20067,071,783'Temperature-compensated power sensing circuit for power amplifiers'20066,977,551'Dual band power amplifier module for wireless communication devices'20056,914,482'Power amplifier module for wireless communication devices'20056,912,446'Systems and methods for automated sensing and machining for repairing airfoils of blades'20056,847,262'Integrated power amplifier module with power sensor'20056,822,515'Accurate power sensing circuit for power amplifiers'2004D0497350'Power amplifier module'20046,774,718'Power amplifier module for wireless communication devices'20046,708,728'Installation of cured in place liners with air and steam and installation apparatus'20046,691,019'Method and system for controlling distortion of turbine case due to thermal variations'20046,486,487'Apparatus and method for measuring and selectively adjusting a clearance'20026,290,895'Selectively flexible caul and method of use'20016,279,400'Apparatus and method for measuring and selectively adjusting a clearance'20016,257,829'Computerized method for positioning support jacks underneath industrial gas turbines'20016,252,925'System and method for performing computed tomography with fiber waveguides'20015,936,718'Method for detecting fiber misalignment in composite manufacturing'19995,857,032'System and method for measuring and monitoring three-dimensional shaped objects'19995,844,669'Detecting and minimizing fiber misalignment in a composite during manufacturing'19985,828,574'Adaptive feedrates from geometry modeling for NC machining'19985,720,597'Multi-component blade for a gas turbine'19985,687,305'Projection of images of computer models in three dimensional space'19975,038,291'Computerized ply pattern generation'19914,833,617'Solid modeling based adaptive feedrate control for NC machining'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2005Patents assigned to GEN ELECTRIC (15)· patent assignee history
1989–2002Based in Schenectady, NY, US· patent location history
2004–2020Patents assigned to MICRO MOBIO CORP (22)· patent assignee history
2004–2008Patents assigned to INSITUFORM NETHERLANDS BV (4)· patent assignee history
2004–2020Based in Palo Alto, CA, US· patent location history
2004–2011Based in Ballwin, MO, US· patent location history
2006–2020Patents assigned to WANG WEIPING (4)· patent assignee history
2010–2011Patents assigned to INA ACQUISITION CORP (3)· patent assignee history
2017–2018Based in Shenzhen, CN· patent location history
2021Based in Shanghai, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRO MOBIO CORP | 22 | 2004–2020 |
| GEN ELECTRIC | 15 | 1989–2005 |
| INSITUFORM NETHERLANDS BV | 4 | 2004–2008 |
| WANG WEIPINGself | 4 | 2006–2020 |
| INA ACQUISITION CORP | 3 | 2010–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Palo Alto, California, US | 31 | 2004–2020 |
| Schenectady, New York, US | 12 | 1989–2002 |
| Ballwin, MO, US | 7 | 2004–2011 |
| Shenzhen, CN | 2 | 2017–2018 |
| Shanghai, CN | 1 | 2021 |