Inventor
NAN-CHENG CHEN
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01QAntennas, i.e. radio aerials22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H05KPrinted circuits4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
12,557,215Semiconductor package using flip-chip technology202611,908,759Semiconductor device202411,848,481Antenna-in-package with frequency-selective surface structure202311,837,552Semiconductor package with layer structures, antenna layer and electronic component202311,721,882Semiconductor package having discrete antenna device202311,373,957Semiconductor package with layer structures, antenna layer and electronic component202211,322,823Antenna-in-package with frequency-selective surface structure2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to MEDIATEK INC (7)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEDIATEK INC | 7 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2026 |