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Inventor

STEPHAN BRADL

Inventor
DE

Overview

3→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
PatentTitleYear
11,652,084Flat lead package formation method202311,410,906Semiconductor package and method for fabricating a semiconductor package202211,302,668Multi-purpose non-linear semiconductor package assembly line2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to INFINEON TECHNOLOGIES AG (3)· patent assignee history
2022–2023Based in DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG32022–2023
Locations
LocationPatentsSpan
DE32022–2023