Inventor
Craig J. Hawker
Inventor
Los Gatos, CA, US
Overview
Patents· 76 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
Y10TTechnical subjects covered by former us classification7%
A61KPreparations for medical, dental or toiletry purposes6%
A61QSpecific use of cosmetics or similar toiletry preparations6%
B82YSpecific uses or applications of nanostructures5%
G11BInformation storage based on relative movement between record carrier and transducer4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
10,792,233Methods and formulations for curling hair202010,639,505Methods for fixing hair and skin202010,280,342Adhesive materials and methods of making and using the same201910,228,619Photopatterned growth of electronically active brush polymers for light emitting diode displays201910,211,400Photopatterned growth of electronically active brush polymers for light emitting diode displays201910,076,478Keratin treatment formulations and methods20189,872,821Methods and formulations for curling hair20189,855,447'Methods for fixing hair and skin'20189,717,668'Methods for treating relaxed hair'20179,713,583'Methods and formulations for curling hair'20179,668,954'Keratin treatment formulations and methods'20179,597,273'Methods for treating relaxed hair'20179,498,419'Keratin treatment formulations and methods'20169,388,326'Compositions for controlled assembly and improved ordering of silicon-containing block copolymers'20169,326,926'Keratin treatment formulations and methods'20169,315,637'Junction-functionalized block copolymers'20169,260,443'Organic electronic devices prepared using decomposable polymer additives'20169,158,200'Compositions for controlled assembly and improved ordering of silicon-containing block copolymers'20159,144,537'Methods for fixing hair and skin'20159,095,518'Methods for fixing hair and skin'20159,081,283'Spatial and temporal control of brush formation on surfaces'20158,911,639'Polymer electrolytes based on poly(glycidyl ether)s'20148,823,154'Encapsulation architectures for utilizing flexible barrier films'20148,387,160'Scanning probe-based lithography method'20138,187,770'High performance, crosslinked polymeric material for holographic data storage'20128,153,729'Highly efficient agents for dispersion of nanoparticles in matrix materials'20128,035,236'Semiconductor device comprising high performance encapsulation resins'20117,943,719'Encapsulation resins'20117,892,635'Precursors for porous low-dielectric constant materials for use in electronic devices'20117,889,629'High density data storage medium'20117,862,858'Scanning probe-based lithography method'20117,732,553'Method of producing encapsulation resins'20107,491,425'Scanning probe-based lithography method'20097,471,614'High density data storage medium'20087,463,572'High density data storage medium'20087,368,483'Porous composition of matter, and method of making same'20087,309,754'Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization'20077,209,324'Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers'20077,196,872'Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization'20077,125,467'Slider processing system utilizing polyvinyl alcohol release layer'20067,101,937'Dendritic based macromolecules'20067,077,970'Sliders bonded by a debondable nonstoichiometric encapsulant'20067,064,929'Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers'20066,992,115'Preparation of crosslinked particles from polymers having activatible crosslinking groups'20066,900,126'Method of forming metallized pattern'20056,890,703'Preparation of crosslinked particles from polymers having activatible crosslinking groups'20056,812,551'Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens'20046,780,492'Substrates prepared by chemical amplification of self-assembled monolayers with spatially localized polymer brushes'20046,685,983'Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens'20046,670,285'Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials'20036,541,865'Porous dielectric material and electronic devices fabricated therewith'20036,531,343'Method of encapsulating a circuit assembly'20036,512,070'Dual purpose electroactive copolymers'20036,433,115'Opto-electronic devices fabricated with dual purpose electroactive copolymers'20026,423,465'Process for preparing a patterned continuous polymeric brush on a substrate surface'20026,413,587'Method for forming polymer brush pattern on a substrate surface'20026,399,666'Insulative matrix material'20026,355,756'Dual purpose electroactive copolymers, preparation thereof, and use in opto-electronic devices'20026,342,454'Electronic devices with dielectric compositions and method for their manufacture'20026,333,141'Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture'20016,326,237'Reworkable thermoplastic hyper-branched encapsulant'20016,300,424'Hyperbranched polyesters and polyamides'20016,177,360'Process for manufacture of integrated circuit device'20016,143,643'Process for manufacture of integrated circuit device using organosilicate insulative matrices'20006,114,458'Highly branched radial block copolymers'20006,110,649'Process for manufacture of integrated circuit device'20006,111,323'Reworkable thermoplastic encapsulant'20006,107,357'Dielectric compositions and method for their manufacture'20006,093,636'Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets'20005,998,876'Reworkable thermoplastic hyper-branched encapsulant'19995,953,627'Process for manufacture of integrated circuit device'19995,895,263'Process for manufacture of integrated circuit device'19995,883,219'Integrated circuit device and process for its manufacture'19995,767,014'Integrated circuit and process for its manufacture'19985,514,764'Hyperbranched polyesters and polyamides'19965,041,516'Dendritic molecules and method of production'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2001Based in Ithaca, NY, US· patent location history
1998–2013Patents assigned to IBM (38)· patent assignee history
1998–2013Based in Los Gatos, CA, US· patent location history
2004–2019Patents assigned to UNIV CALIFORNIA (16)· patent assignee history
2006–2016Patents assigned to HAWKER CRAIG J (6)· patent assignee history
2006–2007Patents assigned to HITACHI GLOBAL STORAGE NETHERL (4)· patent assignee history
2006Based in St. Lucia, AU· patent location history
2008–2020Based in Santa Barbara, CA, US· patent location history
2011Based in Los Gato, CA, US· patent location history
2015–2018Patents assigned to LIQWD INC (11)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 38 | 1998–2013 |
| UNIV CALIFORNIA | 16 | 2004–2019 |
| LIQWD INC | 11 | 2015–2018 |
| HAWKER CRAIG Jself | 6 | 2006–2016 |
| HITACHI GLOBAL STORAGE NETHERL | 4 | 2006–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Los Gatos, California, US | 42 | 1998–2013 |
| Santa Barbara, California, US | 29 | 2008–2020 |
| Ithaca, New York, US | 3 | 1991–2001 |
| Los Gato, California, US | 1 | 2011 |
| St. Lucia, AU | 1 | 2006 |